Corporate Information | HYC Appears at SEMICON China 2023

      SEMICON China 2023 was held at Shanghai New International Expo Center from June 29th to July 1st. HYC Semiconductor Division’s SoC test solution and PXIe platform attracted many audiences to come to consult and request for proposal.

Ultra-large-scale mixed signal chip ATE platform

T7600

HYC Semiconductor displayed the T7600 SoC ATE at this exhibition. This ATE is an ultra-large-scale digital-analog mixed signal test equipment with latest chip technology, multiple iterations of simulation and optimization over 7 years. The voltage accuracy can reach 0.1mV, and the current accuracy can reach 1nA with tester deployment on mass production for MCU chips.

From hardware perspective, the T7600 has three test heads, S, M, and H, which respectively support a maximum of 768, 1536, and 2304 digital channels. The three test heads are compatible with each other, which is convenient for customers to deploy production capacity. From software perspective, the T7600 is fully equipped with HYC self-developed software testing platform HYCTOS, with high parallelism and efficiency. In addition, collaboration between software and hardware greatly reduces chip testing time, improves equipment usage efficiency, and eventually reduces testing costs.

Boards for mass production

Along with T7600, there are 4 boards that have been deployed for mass production (DP128 digital and power board, DPS64 high-density power supply board, MX32 mixed signal board, and FVI32 high-precision power supply board).

PXIe Testing Platform

PXIe is a miniaturized tester, mainly for the testing SiP, MEMS, RF and some SoC chips, with high scalability and flexibility. HYC Semiconductor displayed a variety of PXIe configurations at the exhibition.

PXIe Chassis

6-slot and 12 slot PXIe chassis were displayed to address different customers’needs during the show.

PXIe Boards

There are a variety of boards for PXIe platform, which includes power source test, digital, analog, radio frequency, etc. functional tests. A total of 14 PXIe boards were displayed this time. HYC Semiconductor will continue investing and developing state of boards to address market needs.

TS1800 

TS1800 is a PXIe RF tester with test frequency up to 6GHz and power up to 35dBm supporting SPI, MIPI and custom digital communication library, 32 bidirectional radio frequency ports, high power 8 in and 8 out. It is deployed for mass production in leading domestic semiconductor companies.

Booth design competition: Top6

HYC’s booth was shortlisted for top 6 in the "Booth Design Competition" held by SEMICON China. Tiewei Pan, deputy general manager of HYC, stepped up on the stage to accept the award. This award is not only a commendation to the exhibitor for its meticulous preparation, but also a recognition of HYC’s booth design innovation.

       HYC Semiconductor Division is committed to provide customers with efficient and stable semiconductor equipment. With testing equipment as its core business, HYC is initiating strategic plan for advanced semiconductor process equipment, which includes SoC chip, CIS chip, BMS chip, RF chip and SIP chip inspection in addition to AOI wafer defect inspection and six-sided chip inspection.

HYC ended SEMICON China 2023 successfully!

See you next year!